http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7481784-B2

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filingDate 2004-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2009-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2009-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7481784-B2
titleOfInvention Wall structure
abstract A wall structure ( 2 ) and components incorporating such a wall structure that are intended to be exposed to high thermal loads. The wall structure ( 2 ) includes at least two layers; a first layer ( 5 ) and a second layer ( 6 ), the second layer ( 6 ) being located closer to a source of the thermal load than the first layer ( 5 ). The layers ( 5, 6 ) are arranged so that heat is allowed to be conducted from the second layer ( 6 ) to the first layer ( 5 ). Each of the first and second layers ( 5, 6 ) are adapted to carry a significant portion of a structural load, and the second layer ( 6 ) exhibits a higher thermal conductivity and/or a lower thermal expansion than the first layer ( 5 ) which reduces thermal strain in the wall structure ( 2 ).
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