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publicationDate 2009-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7473459-B2
titleOfInvention Method of manufacturing a film printed circuit board
abstract A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the alloy layer and a plurality of conductive line structures is formed on the polyimide substrate. A second copper layer is formed over the polyimide substrate and the conductive line structures. A second lithographic and etching process is performed to pattern the second copper layer.
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