| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a07d0b3e3169dd026ecd9113fc9cc4ad |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F2998-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F1-052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F1-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F1-0545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-0545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-052 |
| filingDate |
2004-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3272b234ca771fb809e8be4e8ce6bc8 |
| publicationDate |
2008-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7459201-B2 |
| titleOfInvention |
Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board |
| abstract |
The present invention sufficiently secures conductor component content ratio in wiring formed on a multilayer circuit board and increases reliability by fabricating the multilayer circuit board by steps of drawing wiring precursor patterns containing a paste of compound for forming wiring conductor containing (a) superfine metal particles (metal nanoparticles) whose average particle size is 1-10 nm; (b) an organic coating compound coated on the surface of the superfine metal particle in the film thickness of 1-10 nm; (c) a latent reactive organic compound reacting with the organic coating compound in the range of 100-250° C., (d) metal particles whose average particle size is 0.5-10 μm, and (e) dispersion medium that stably disperses components (a) through (d) on a substrate by screen printing, sintering by heating the patterns to 100-250° C., and electrochemically treating the patterns to allow the conductor to deposit in a desired cross-sectional area in the inside. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8815127-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009274834-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013140500-A1 |
| priorityDate |
2003-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |