| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdad00677b9268c26e005a9e03a7b9dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-0385 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76808
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8242 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
| filingDate |
2004-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31c67ada633b7d4707e1a81572039a6d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7dee13d2eb2f27c31851606f1d4db73f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a75bec8ad3280a8fe642d912bd1098e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7458e40273196eb9c69bf4339b71cb97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7f2508bc889c9acc76d18a9dedfae14 |
| publicationDate |
2008-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7452819-B2 |
| titleOfInvention |
Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device |
| abstract |
There is disclosed a chemical mechanical polishing method of an organic film comprising forming the organic film above a semiconductor substrate, contacting the organic film formed above the semiconductor substrate with a polishing pad attached to a turntable, and dropping a slurry onto the polishing pad to polish the organic film, the slurry being selected from the group consisting of a first slurry and a second slurry, the first slurry comprising a resin particle having a functional group selected from the group consisting of an anionic functional group, a cationic functional group, an amphoteric functional group and a nonionic functional group, and having a primary particle diameter ranging from 0.05 to 5 μm, the first slurry having a pH ranging from 2 to 8, and the second slurry comprising a resin particle having a primary particle diameter ranging from 0.05 to 5 μm, and a surfactant having a hydrophilic moiety. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009005495-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8357286-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8232344-B2 |
| priorityDate |
2003-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |