http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7444058-B2

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filingDate 2007-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2008-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_379974967e7e926d5cb54f699c4d8cf8
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publicationDate 2008-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7444058-B2
titleOfInvention Resin composition for optical wiring, and optoelectronic circuit board
abstract This invention is a resin composition for optical wiring, comprising an inorganic filler with an average particle size of 1 nm to 100 nm and a resin, having a ratio n f /n r (where n f is the refractive index of the inorganic filler and n r is the refractive index of the resin) of 0.8 to 1.2, a thermal expansion coefficient of −1×10 −5 /° C. to 4×10 −5 /° C., and a true dependency value of its refractive index on the temperature of −1×10 −4 /° C. to 1×10 −4 /° C. in a temperature range from −20° C. to 90° C., and substantially incapable of absorbing light in a wavelength range from 0.6 to 0.9 μm or from 1.2 to 1.6 μm. This invention also provides an optoelectronic circuit board.
priorityDate 2004-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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