http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7362575-B2
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_61155939891010276932bda73b832c00 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3732 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
filingDate | 2006-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2008-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a31e6b45ad7f00db19c2b2bd5099e8be |
publicationDate | 2008-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | US-7362575-B2 |
titleOfInvention | Cooling method use diamond pins and heat pipes |
abstract | An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one configurable diamond pin; at least one heat pipe; and a heat sink structure. At least one diamond pin is configured to displace junction temperature on a hot spot location of the microprocessor. The heat sink structure and at least one heat pipe are configured atop the second thermal interface material layer. In a method of cooling a microprocessor including a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid, the method includes disposing at least one configurable diamond pin at a hot spot location of the microprocessor; and configuring a heat sink structure and at least one heat pipe atop the second thermal interface material layer. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016345463-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9807913-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009178785-A1 |
priorityDate | 2006-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.