| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763 |
| filingDate |
2005-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4a033c0b35b7b3eb0aca9e25f7f43d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_337179e3e8fbced29a3ae62a26cc5ac9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87233841f30375a484a710d8917bcaa5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8eabee6d999c0ce1a7427c3371495db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_803be1a1f2b094b981f75f0f7f7f13c3 |
| publicationDate |
2008-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7358182-B2 |
| titleOfInvention |
Method of forming an interconnect structure |
| abstract |
A method of forming damascene interconnect structure in an organo-silicate glass layer without causing damage to the organo-silicate glass material. The method includes forming a stack of hardmask layers over the organo-silicate glass layer, defining openings in the hardmask and organo-silicate glass layers using a combination of plasma etch and plasma photoresist removal processes and performing one or more additional plasma etch processes that do not include oxygen containing species to etch the openings to depths required for forming the damascene interconnect structures and to remove any organo-silicate material damaged by the combination of plasma etch and plasma photoresist removal processes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9058983-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8048811-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011039413-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009246951-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8906810-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8668835-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009004810-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8513114-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8138093-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7678689-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012276735-A1 |
| priorityDate |
2005-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |