| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0369
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0179
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4647 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2002-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7537d1bcdf2eabf63ed12d022d8b7d87 |
| publicationDate |
2008-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7358116-B2 |
| titleOfInvention |
Substrate conductive post formation |
| abstract |
A substrate with at least one conductive post formed prior to the formation of an inter-layer dielectric (ILD) coating on the substrate. The conductive post may be formed from a metal layer of the substrate. Additionally, the conductive post may be built up on the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010213592-A1 |
| priorityDate |
2002-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |