| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5c57fd72edf84ed32b1124d25222624 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1214 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1214
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67196
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30 |
| filingDate |
2004-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca5bbffcf05d6f5a44191ded55e13c12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4226a45338aa9c64a9b4ed6bc40f50ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57efc843c96f7b2e48d2194a8328a50d |
| publicationDate |
2008-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7354845-B2 |
| titleOfInvention |
In-line process for making thin film electronic devices |
| abstract |
An embodiment of the present invention relates to an in-line process for making a thin film electronic device on a substrate. The process includes depositing a structurable layer onto a substrate and depositing photoresist material onto the structurable layer in a first pattern. The process also includes developing the photoresist material, etching the structurable layer in areas uncovered by the photoresist material and removing the remaining photoresist material. The process may be performed without intermediate exposure of the substrate to ambient air. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8080366-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007238054-A1 |
| priorityDate |
2004-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |