http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7335460-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0d1a147228feb227e208a391aa580497 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2006-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de9c01aadfac200b42e704cdfde68db1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8613cc312a20e8b393bc27e779029317 |
| publicationDate | 2008-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-7335460-B2 |
| titleOfInvention | Photosensitive thermosetting resin composition, and photosensitive cover lay and flexible printed wiring board using the composition |
| abstract | An object of the present invention is to provide a photosensitive thermosetting resin composition that has a long shelf life and has excellent normal temperature storage stability, has good solder heat resistance after curing, and according to which high adhesive strength can be maintained. The present invention provides a photosensitive thermosetting resin composition containing a photosensitive prepolymer, a photosensitive monomer, a thermosetting resin, a curing agent, and a polymerization initiator, the photosensitive thermosetting resin composition containing (A) a carboxylic acid-modified bisphenol type epoxy (meth)acrylate as the photosensitive prepolymer. |
| priorityDate | 2005-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 89.