| abstract |
A chip or wafer comprises a semiconductor substrate, first and second transistors on the semiconductor substrate, first and second metal layers over the semiconductor substrate, an insulating layer on the first and second metal layers, a third and fourth metal layers on the insulating layer, a passivation layer over the third and fourth metal layers, and a fifth metal layer over the passivation layer. A signal is suited to be transmitted from the first transistor to the second transistor sequentially through the first, third, fifth, fourth and second metal layers. |