| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5b697aa5d3346981b6c6de88dcb0d50d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-963
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763 |
| filingDate |
2004-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23b6b33863004f7a5f7941c34197f11c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97a90246c91c195cb5d078c82c44f37a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b241c9fd26fc23db0d0a4cb91179113e |
| publicationDate |
2007-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7235489-B2 |
| titleOfInvention |
Device and method to eliminate shorting induced by via to metal misalignment |
| abstract |
The present invention provides an interconnect that can be employed in an integrated circuit. The interconnect includes a metal line located over a substrate, a dielectric layer located over the metal line, and an interconnect located in the dielectric layer, including a landed portion located over the metal line and an unlanded portion located along at least a portion of a lateral edge of the metal line. The unlanded portion is at least partially filled with a polymer, and the landed portion is substantially filled with a conductive material. A method for manufacturing the interconnect is also provided. |
| priorityDate |
2004-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |