| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-024 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-40 |
| filingDate |
2004-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87660bbf898106305b3de4f98cb2e82f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca31e4d820429600cd27758b744606e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03331d5fa1c7642ad17459d2128f0918
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70dafb4023728bc3f4a2eedd373992fa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a08ab3922c8d20ea0d50d52c5c1d1ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47f91dc54f48eb8a6130e66583b8f2d2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_61accd20a06c8e80d39180fa167429cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60ad1da05a7c8fbb2fa38dd00943f26e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2e18224761f45fd15689c0e541274e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b03e9ba0248a16b700dabd53a209919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4405fa8c1b0f24a5f331b217d3f246a8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3304ef43bec944f07179ba659683a4c8 |
| publicationDate |
2007-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7227265-B2 |
| titleOfInvention |
Electroplated copper interconnection structure, process for making and electroplating bath |
| abstract |
Interconnect structures with copper conductors being at least substantially free of internal seams or voids are obtained employing an electroplating copper bath containing dissolved cupric salt wherein the concentration of the salt is at least about 0.4 molar and up to about 0.5 molar concentration of an acid. Also provided are copper damascene structures having an aspect ratio of greater than about 3 and a width of less than about 0.275 μm and via openings filled with electroplated copper than is substantially free of internal seams or voids. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008142852-A1 |
| priorityDate |
2000-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |