| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0d918562ea547631471f1eed47b8e5e4 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76861 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2004-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ae16913e16be163c6f2bb260a5781d3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d6df00b3b71649c975df483cd65ed4c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5999da9dac8c504cf4767b22b672df41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_767294ba06a4ff44bd5b559b9e78f0f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc930d55e685b71e5c8f17d2ee3955ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8edb658cca2d2ac116f616045cc42000
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dde2b3cb60012e7821f21de0a3d88103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93f758adf5252595ddbaaf96d5ab984d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5981dab47306e825b032d195ec7aebd |
| publicationDate |
2007-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7226860-B2 |
| titleOfInvention |
Method and apparatus for fabricating metal layer |
| abstract |
A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemical surface treatment process. The electrochemical plating cell is covered by a cap to prevent evaporation of the electrolyte solution. The electrochemical plating cell includes a substrate holder assembly with a lift seal, e.g., with a contact angle θ less than 90° between the lift seal and the substrate. The substrate holder assembly includes a substrate chuck at the rear side of the substrate. |
| priorityDate |
2004-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |