| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D11-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D18-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D18-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-22 |
| filingDate |
2003-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c6f971cdceff456bcd6a057751cbc3f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60ab612faf40cec915d12bcbd1587066 |
| publicationDate |
2007-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7192336-B2 |
| titleOfInvention |
Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
| abstract |
Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to the selected energy source. The planarizing pad material is exposed to a solvent to remove material from one of the first or second portions of the planarizing pad material at a faster rate than removing material from the other of the first and second portions. The process forms a plurality of recesses directly in the surface of the planarizing pad which are configured to support a planarizing liquid proximate to the surface of the planarizing pad material during planarization of the microelectronic substrate. Alternatively, the process can form a mold having protrusions that are pressed into the planarizing pad to define the recesses in the pad. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11446788-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018207770-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109075057-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017155969-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11772229-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11745302-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10786885-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10773509-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11524384-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109075057-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11685014-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11724362-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11471999-B2 |
| priorityDate |
2000-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |