| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a0f26a9c2efad3ae086a108f3c04b57d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0209 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
| filingDate |
2004-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a68a40bbf9d0763ebe7f7bba56488d02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f229652e2b3d474582e05117750503d1 |
| publicationDate |
2007-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7172977-B1 |
| titleOfInvention |
Method for non-destructive removal of cured epoxy from wafer backside |
| abstract |
Disclosed is a method for non-destructive removal of cured epoxy from a wafer backside. A wafer back-coated with epoxy is soaked in an acetone bath for a period of time, allowing degradation of the epoxy coating adhesion strength. The epoxy coating is then peeled or scraped away, leaving the wafer backside ready for a rework or for a reapplication of a new epoxy coating. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008124928-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010055916-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114260298-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7666321-B2 |
| priorityDate |
2004-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |