| abstract |
A curing low dielectric loss tangent film using a low dielectric loss tangent composition containing a polyfunctional styrene compound having excellent dielectric characteristics, and a wiring film using the same as an insulating layer are provided. The low dielectric loss tangent film contains a high molecular weight material and a crosslinking ingredient with a weight average molecular weight of 1000 or less having a plurality of styrene groups shown by the following general formula: n n(where R represents a hydrocarbon skeleton, R 1 , which may be identical or different with each other, represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms, R 2 , R 3 and R 4 , which may be identical or different with each other, each represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, m represents an integer of 1 to 4, and n represents an integer of 2 or greater). |