| abstract |
An adhesive resin composition comprising, based on the total weight of the composition, a first resin component having one or more glass transition temperatures of about −15 to about 50° C.; optionally, up to about 49 weight percent of a second resin component having one or more glass transition temperatures greater than about 100° C.; and up to about 50 weight percent of a particulate inorganic filler; wherein a tan δ value of the adhesive resin composition is greater than about 0.2 over a temperature range of about −15 to about 50° C. when measured at a frequency of 1 Hz. The adhesive resin compostions are of particular utility in suspension assemblies. |