| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
| filingDate |
2000-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8043f55e4bc900228122cff2c10553e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5e9102a099ce79ed6ad0077b47a6456
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5bfdce8ecaad9d5c9457ee9bb9a22f95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2b74a3a96924e874a252863daa84c0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1a9dc4e459bbd8b96ff73dfe1196e1f |
| publicationDate |
2006-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7104267-B2 |
| titleOfInvention |
Planarized copper cleaning for reduced defects |
| abstract |
A process for treating a copper or copper alloy substrate surface with a composition and corrosion inhibitor solution to minimize defect formation and surface corrosion, the method including applying a composition including one or more chelating agents, a pH adjusting agent to produce a pH between about 3 and about 11, and deionized water, and then applying a corrosion inhibitor solution. The composition may further comprise a reducing agent and/or corrosion inhibitor. The method may further comprise applying the corrosion inhibitor solution prior to treating the substrate surface with the composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8920567-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9340759-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9869027-B2 |
| priorityDate |
1999-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |