Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-09 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C1-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C1-795 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-30 |
filingDate |
2001-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2006-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a08c84ba74591489279473e5f9e26aa3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_824072a2cd2e301d720dc1bad9835989 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f2b75c99fda4e28000da74a45b571a5 |
publicationDate |
2006-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-7078151-B2 |
titleOfInvention |
Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
abstract |
A photosensitive element comprising a support film and a photosensitive resin layer formed on the support film is provided, wherein the support film is a multilayer support film comprising at least three layers; and wherein the photosensitive resin layer comprises a photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule, and (C) a photopolymerization initiator. Also provided are a method of forming a resist pattern comprising the steps of laminating such a photosensitive element onto a circuit-forming substrate such that the photosensitive resin layer comes into close contact therewith; forming an exposure part by irradiating a predetermined part of the photosensitive resin layer with an active light beam; and then eliminating a part other than the exposure part; and a method of making a printed circuit board comprising the step of etching or plating the circuit-forming substrate formed with a resist pattern by this method of forming a resist pattern. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8795951-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011081615-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7309559-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008097000-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008063955-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8026045-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004063025-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008241759-A1 |
priorityDate |
2000-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |