| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 |
| filingDate |
2003-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f81b2fbc59f32d0e8bf4804589d105e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77e82343ed65b6040de3beeaa80eb173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_629f57b325d9d9cf2ae5b014c84e5fc5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bbdfb1d05d65fd6ad06b4fc550039602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de380e63e610856dd1cc7c0990c150bd |
| publicationDate |
2006-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7071032-B2 |
| titleOfInvention |
Material to improve image sensor yield during wafer sawing |
| abstract |
A new method is provided of treating the wafer prior to the process of singulating the wafer into individual die. A first surface of the wafer over which CMOS image sensor devices have been created is coated with a layer of material that is non-soluble in water. The wafer is attached to a tape by bringing a second surface of the wafer in contact with the tape. The wafer is singulated by approaching the first surface of the wafer and by sawing first through the layer of material that has been coated over the first surface of the wafer and by then sawing through the wafer, stopping at the surface of the tape. A thorough water rinse is applied to the surface of the singulated wafer, followed by a wafer clean applying specific chemicals for this purpose. The singulated die is now removed from the tape and further processed by applying steps of die mount, wire bonding, surrounding the die in a mold compound and marking the package. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006105545-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8033011-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010035405-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11218651-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7435663-B2 |
| priorityDate |
2002-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |