| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38e72bf35b2c9cf15b388d0378b79abd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3421
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3447
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-1034
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10977 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00 |
| filingDate |
2004-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c754709ce4df3d25ab0ec9348d2ae744
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c72b72e63f96feab1b7b68588d504ca |
| publicationDate |
2006-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7064963-B2 |
| titleOfInvention |
Multi-substrate circuit assembly |
| abstract |
Thermally managing high-power IC devices through the use of a circuit assembly comprising a ceramic substrate and an organic substrate. The ceramic substrate has at least one circuit component on a first surface thereof and a periphery defining a lateral surface surrounding the first surface. The organic substrate also comprises a first surface and a periphery defining a lateral surface surrounding the first surface. A portion of the lateral surface of the organic substrate is adjacent a portion of the lateral surface of the ceramic substrate so as to define an interface therebetween. At least one conductor common to both the ceramic and organic substrates and bridging the interface therebetween serves to physically connect the ceramic and organic substrates together. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10744603-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8006747-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8199509-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015257309-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7821117-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8505613-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7606034-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009129022-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011297362-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006215369-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9433130-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009261482-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007285898-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010315785-A1 |
| priorityDate |
2004-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |