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filingDate 2001-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2006-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7029550-B2
titleOfInvention Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
abstract An energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet has, on at least one side of a base material, an energy-beam-curable viscoelastic layer and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres stacked in this order. The energy-beam-curable viscoelastic layer is, for example, composed of a composition of an organic viscoelastic body and an energy-beam-curable compound or an energy-beam-curable resin. The energy-beam-curable viscoelastic layer has a thickness of about 5 to 300 μm or may be not greater than the maximum particle size of the thermo-expandable microspheres. The energy-beam-curable thermal-releasable pressure-sensitive adhesive layer according to the invention has adhesion enough to withstand a carrying step of an adherend, causes neither winding up of the adhesive nor chipping upon cutting and facilitates peeling and collection of cut pieces after cutting.
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