http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7026383-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ef01e33058cf740cf2197991be97af1 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2003-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e5214752f6329d20cf952ce2a24b438 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fa3173fac49cf17417927ee06932ebf |
| publicationDate | 2006-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-7026383-B2 |
| titleOfInvention | Polyamide resin composition and molded article thereof |
| abstract | A polyamide resin composition comprises a polyamide resin component (A) and a metallic soap component (B), wherein the polyamide resin component (A) comprises a dicarboxylic acid component (a-1), which comprises a terephthalic acid component and an aromatic dicarboxylic acid component other than the terephthalic acid component and/or an aliphatic dicarboxylic acid component of 4 to 20 carbon atoms, and a diamine component (a-2), which comprises an aliphatic diamine component; and the metallic soap component (B) comprises a metallic soap comprising an aliphatic carboxylic acid and a monovalent or divalent metal salt The polyamide resin composition has excellent heat resistance and is favorably used as a molding material for electric or electronic parts and automotive parts. The polyamide resin composition is excellent in flowability, mold-releasing properties and shot stability in the injection molding process. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011281996-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8575264-B2 |
| priorityDate | 2002-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 141.