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filingDate 2002-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2006-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8024fee0dada1f045a17f44e6fb26d3
publicationDate 2006-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7022215-B2
titleOfInvention System and methods for analyzing copper chemistry
abstract The present invention relates to methods for removing the matrix effects caused by variance in copper concentration and acidity during measurement of the organic additive concentration in a sample copper plating solution.
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