Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81cfb88d909c75104c0c8d61799a72b0 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2021-3595 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-359 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-3577 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-416 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-42 |
filingDate |
2002-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2006-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8024fee0dada1f045a17f44e6fb26d3 |
publicationDate |
2006-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-7022215-B2 |
titleOfInvention |
System and methods for analyzing copper chemistry |
abstract |
The present invention relates to methods for removing the matrix effects caused by variance in copper concentration and acidity during measurement of the organic additive concentration in a sample copper plating solution. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005109624-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006102475-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005224370-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7427346-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7427344-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7435320-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005247576-A1 |
priorityDate |
2001-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |