| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1152 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2002-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f81fd5ae4967a4c79b6a03e969a37ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b1d3d1b364a01ae7be164af54b7fb68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e576e1c5812aea27831d3a4da0a74609 |
| publicationDate |
2006-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7017265-B2 |
| titleOfInvention |
Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured thereby |
| abstract |
A method is provided for manufacturing a multilayer wiring board wherein good adhesion is achieved between an insulating layer and a wiring pattern. The multilayer wiring board has a laminar structure which includes insulating layers and a wiring pattern. The method includes at least the steps of sticking a support whose surface has been treated with a coupling agent onto an insulating layer with a coupling agent interposed therebetween, and transferring the coupling agent to the insulating layer by removing the support while leaving the coupling agent on the insulating layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006230611-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009229762-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006070769-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8230891-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8584352-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013243941-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10893613-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7661190-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018153043-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005144780-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011036625-A1 |
| priorityDate |
2002-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |