| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24926 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34 |
| filingDate |
2002-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_783ea4c4aab58a8844c52066bceb3851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9578f7c909966c1c02895e6e986f3683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a2eca2f8f4524de3d4b5c85070a3fa2 |
| publicationDate |
2006-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7001641-B2 |
| titleOfInvention |
Seed layer treatment |
| abstract |
Seed layer treatment to remove impurities in the seed layer that might lead to the formation of voids in interconnect circuit features. In one embodiment, the seed layer is heated in a reducing environment. In another embodiment, the seed layer is washed with a surfactant that is compatible with a surfactant used when forming the remainder of the circuit feature on the seed layer. Yet another embodiment combines both techniques. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008113508-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008264774-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004118697-A1 |
| priorityDate |
2002-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |