http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6977036-B2

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filingDate 2004-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2005-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6977036-B2
titleOfInvention Method and apparatus for substrate polishing
abstract A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.
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