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publicationDate 2005-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6969660-B2
titleOfInvention Method of manufacturing a semiconductor device with trench isolation between two regions having different gate insulating films
abstract The major surface of a semiconductor substrate of a semiconductor device includes first and second regions and a boundary area therebetween. A first gate insulating film and a first gate electrode are formed in the first region. A second gate insulating film different from the first gate insulating film and a second gate electrode are formed in the second region. A device isolation region is formed in the boundary area. This device isolation region includes a trench formed in the major surface, and an insulating layer having a portion buried in the trench and a portion projecting upward from the major surface. The bottom of the trench has depths different with portions.
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