Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a34d7d2e0d09a58cb7bf4a04c81162e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0802 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C3-002 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-097 |
filingDate |
2003-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2005-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_672df128adbf69ea4931c1f9f78f463c |
publicationDate |
2005-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-6938334-B2 |
titleOfInvention |
Vibrating beam accelerometer two-wafer fabrication process |
abstract |
A method for fabrication of microelectromechanical systems (MEMS) integrated micro devices and acceleration sensor devices formed according to the method, the method being micromachining an array of first three-dimensional micromechanical device features in a first silicon wafer; micromachining an array of second three-dimensional micromechanical device features in a second silicon wafer, wherein the second three-dimensional micromechanical device features are configured to cooperate with the first three-dimensional micromechanical device features when joined therewith; mutually aligning the first and second arrays of device features by aligning the first and second wafers; permanently joining the first and second arrays of device features into an array of integrated micro devices as a function of permanently joining the first and second wafers into a single composite wafer; and subsequently separating the array of integral devices into individual devices each having a set of the first and second device features. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10508026-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7390723-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008202258-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8955382-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9327965-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006139643-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008044059-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7069790-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7945087-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008233673-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7810373-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8501584-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7257512-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9890038-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9580302-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9862594-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10280074-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8220330-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11174154-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010242603-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7666700-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9758368-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010054092-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9266717-B2 |
priorityDate |
2003-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |