| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6bd0cdbc5c67cf4957ed83c89140748e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 |
| filingDate |
2003-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37e0ec6b0d90ddad0b922b440d918a34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_316a42b64c875f816e7c54663cfde302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c09a200b16e35a02f9793d04478ed92c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab6f61062f440721540e4ad8503502b4 |
| publicationDate |
2005-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6875519-B2 |
| titleOfInvention |
Two-layer copper polyimide substrate |
| abstract |
A two-layer copper polyimide substrate includes a modified layer on the surface of a polyimide film having a thickness of not more than 200 Å, and preferably not less than 50 Å, as evaluated by a method by dyeing a section thereof with a silver nitrate aqueous solution and observing it by a transmission electron microscope (TEM). A metal seed layer is formed on the polyimide film surface, followed by forming a copper layer thereon by copper electroplating or copper electroless plating or a combination of the both, providing a two-layer copper polyimide substrate in which any of an initial adhesion, a heat resistant adhesion after standing in air at 150° C. for 168 hours, and a PCT adhesion after PCT test at 121° C. and at a humidity of 95% under 2 atmospheres for 100 hours are 400 N/m or more. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10021789-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007090086-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7523548-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007101571-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010189974-A1 |
| priorityDate |
2002-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |