http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6872762-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ef85d661b9a18307a5a59ff4eca96233 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-186 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 |
| filingDate | 2003-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83533e26f564bf509febde28e6721e29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06224d84198a64535a3651142851845a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec5a9875590a1683c8189a3ad3f15245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35efe3b2123107f1f3e6c04b2a01ea96 |
| publicationDate | 2005-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-6872762-B2 |
| titleOfInvention | Epoxy resin composition with solid organic acid |
| abstract | This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, optionally a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to about 9.0, such as less than or equal to about 7.5. The invention also relates to curable epoxy-based compositions including an epoxy compound, a thixotropy-conferring component, a latent hardener and at least one of the solid organic acids above demonstrating improved rheological properties such as yield point maintenance and viscosity maintenance over time. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101242627-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11059967-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160097829-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9290462-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11584823-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10283378-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012059558-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10144799-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016200860-A1 |
| priorityDate | 2000-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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