Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7685 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76867 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
2002-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2005-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27d5e02520f3050ff3402fd7bc1a17f6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b51e30378bb17ea6392f81495306b86d |
publicationDate |
2005-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-6867135-B1 |
titleOfInvention |
Via bottom copper/barrier interface improvement to resolve via electromigration and stress migration |
abstract |
A method of forming a copper/barrier layer interface comprising the following sequential steps. A structure having a lower copper layer formed thereover is provide. A patterned dielectric layer is formed over the lower copper layer. The patterned dielectric layer having an opening exposing a portion of the lower copper layer. The exposed portion of the lower copper layer is converted to a copper silicide portion. A barrier layer is formed upon the patterned dielectric layer and the copper silicide portion, lining the opening, whereby the lower copper layer/barrier layer interface is formed such that the barrier layer contacts the copper silicide portion to form an interface. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008017988-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9881871-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011108986-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7678686-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011223762-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8405201-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006121725-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010078074-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8729703-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7964496-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8193086-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8432038-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007082488-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9129968-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10943867-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7569467-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10332838-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008063417-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102008063417-B4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8232201-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008119047-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010314758-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8440564-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8846523-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8791011-B2 |
priorityDate |
2002-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |