| abstract |
A curable composition comprising (A) a polyfluorodialkenyl compound having at least two alkenyl radicals, (B) a fluorinated organohydrogensiloxane having at least two Si—H radicals, (C) a platinum group compound, (D) a hydrophobic silica powder, and (E) an organosiloxane having a Si—H radical and a trialkyl or trialkoxy-containing organic radical attached to a silicon atom cures into a product having improved solvent resistance, chemical resistance, heat resistance, low-temperature properties, low moisture permeability and electric properties and exhibiting good adhesion to a variety of substrates including metals and plastics by brief heating at relatively low temperatures. |