| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0358
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0133 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2002-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe2fdc69dacf2edbcbc23ed2536c664f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ce92ede0c06cbf5379916c9304e9832
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3f8b1dd1dda805edf4e39bc1d886bb5 |
| publicationDate |
2004-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6831129-B2 |
| titleOfInvention |
Resin-coated copper foil, and printed wiring board using resin-coated copper foil |
| abstract |
An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition: |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007102804-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7485361-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006166005-A1 |
| priorityDate |
2001-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |