| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20b5168a2f9d7f3f6f4457ec6f1f95f6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24994 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-3322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L51-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L51-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-332 |
| filingDate |
2002-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1559a1783ab25ffb220cb5eee2e61599
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5d63987a10c6f1502dc427eb9b25399
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eae0b2ea8f9ce62fcabfae6c89e1d0e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b4e9b6188c09690c85ddd803d9647a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0fa31e496d0d021f31b58dfe74685ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2218cba1b97c65bcb879ca16cb333f58 |
| publicationDate |
2004-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6803414-B2 |
| titleOfInvention |
Damping resin composition and damping resin article for structure using the resin composition |
| abstract |
A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C) containing an unsaturated polyester (B) and a cross-linking monomer (C), and/or an epoxy acrylate resin (B'+C) containing an epoxy acrylate (B') and a cross-linking monomer (C), wherein the bifunctional diacrylate or bifunctional dimethacrylate (A) is contained in an amount of 15 to 85% by weight, and the unsaturated polyester resin (B+C) or the epoxy acrylate resin (B'+C) or a mixture (B''+C) thereof that contains the unsaturated polyester resin (B+C) in an amount of 5 to 95% by weight and the epoxy acrylate resin (B'+C) in an amount of 95 to 5% by weight is contained in an amount of 85 to 15% by weight, the bifunctional diacrylate or bifunctional dimethacrylate (A) being expressed by:where n is integer that is equal to or greater than 2, R1 is an alkylene or polymethylene chain having 2 to 13 carbon atoms, and R2 is hydrogen or a methyl group. Also provided is a damping resin article for a structure that is formed from the above damping resin composition by various molding methods. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101883823-A |
| priorityDate |
1999-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |