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filingDate 2002-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2004-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2004-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6797638-B2
titleOfInvention Plasma-etching process for molybdenum silicon nitride layers on half-tone phase masks based on gas mixtures containing monofluoromethane and oxygen
abstract A method for etching phase shift layers of half-tone phase masks includes etching a phase shift layer by using a plasma which is obtained from CH 3 F and O 2 . A high cathode power is used for the etching. The method has a very high selectivity between the substrate and the phase shift layer, so that half-tone phase masks with a high imaging quality can be produced.
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