| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1903 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C7-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C7-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11C7-18 |
| filingDate |
2003-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_749b8a125d3fc05506979b5e4d6ea60b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2315e44ae271248d6eedd16a4875146d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c57f819f0db1c9d62325fac624278521 |
| publicationDate |
2004-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6794735-B2 |
| titleOfInvention |
High permeability composite films to reduce noise in high speed interconnects |
| abstract |
A transmission line circuit provides a structure for improved transmission line operation on integrated circuits. The transmission line circuit includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A number of high permeability metal lines are formed on the first layer of insulating material. The number of high permeability metal lines includes composite hexaferrite films. A number of transmission lines is formed on the first layer of insulating material and between and parallel with the number of high permeability metal lines. A second layer of insulating material is formed on the transmission lines and the high permeability metal lines. The transmission line circuit includes forming a second layer of electrically conductive material on the second layer of insulating material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8278225-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005007817-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7335968-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7483286-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7154354-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7737536-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6970053-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003142569-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8501563-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002145901-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005140462-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7101778-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8524618-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003174529-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7391637-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7869242-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004233010-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8921914-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7670646-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005030780-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7327016-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7829979-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005006727-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006261448-A1 |
| priorityDate |
2002-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |