| abstract |
A semiconductor device ( 51 ) is provided. The device ( 51 ) comprises a die ( 53 ) having a contact pad ( 61 ) thereon, a redistribution conductor ( 59 ) having a base portion ( 64 ) which is in electrical communication with the contact pad ( 61 ) and a laterally extending portion ( 63 ), a bumped contact ( 65 ) which is in electrical communication with the redistribution conductor ( 59 ), and a passivation layer ( 57 ) disposed between the laterally extending portion ( 63 ) of the redistribution conductor ( 59 ) and the die ( 53 ). Preferably, the redistribution conductor ( 59 ) is convoluted and is adapted to peel or delaminate from the passivation layer ( 57 ) under sufficient stress so that it can shift relative to the passivation layer ( 57 ) and base portion ( 64 ) to relieve mechanical stress between substrate ( 69 ) and the die ( 53 ). Bump and coiled redistribution conductor ( 59 ) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process. |