| abstract |
Circuit boards ( 1100, 1500, 1600, 1700 ) and methods for fabricating circuit boards that include heaters for maintaining temperature sensitive components at an operating temperature are provided. Resistive traces ( 602, 702,704 ) are included in the circuit boards proximate temperature sensitive apparatus ( 1004, 1304, 1602, 1712 ). Thermally conductive patches ( 802, 902, 904 ) are interposed between the resistive traces and the temperature sensitive components. The thermally conductive patches establish zones of relatively uniform temperatures. According to a preferred embodiment of the invention the temperature sensitive apparatus comprises a fluid conduit ( 1004 ). |