| abstract |
Disclosed is a thermal interface composition which undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source to a heat sink, the composition comprising:(A) a viscoelastic composition which softens at about the operating temperature of the heat source, the viscoelastic composition comprising:(1) a thermoplastic elastomer,(2) a compatible hydrocarbon oil, and(3) a tackifying resin;(B) a dispersing agent; and(C) a thermally conductive filler dispersed within the viscoelastic composition.Also disclosed is a method for making the thermal interface composition. |