patent/US-6774471-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6774471-B2

Outgoing Links

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filingDate	2002-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2004-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17cbc05004f9a402f4f0b76ad2c252ad
publicationDate	2004-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-6774471-B2
titleOfInvention	Protected bond fingers
abstract	A package substrate having a finger projection that is either an elevated or removably covered bond finger. The finger portion includes a portion to remain uncovered by a die and an underfill material when the package substrate is coupled to the die. A second portion of the finger projection may allow the first portion to remain uncovered as indicated.
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priorityDate	2002-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 72.