http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6727183-B1

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate 2001-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2004-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f7ae5758f9d734fa33e6efd146a19b6
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publicationDate 2004-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6727183-B1
titleOfInvention Prevention of spiking in ultra low dielectric constant material
abstract A novel etching method for preventing spiking and undercutting of an ultra low-k material layer in damascene metallization is described. A region to be contacted is provided in or on a semiconductor substrate. A liner layer is deposited overlying the region to be contacted. An ultra low-k dielectric layer is deposited overlying the liner layer. A damascene opening is etched through the ultra low-k dielectric layer to the liner layer overlying the region to be contacted wherein this etching comprises a high F/C ratio etch chemistry, high power, and low pressure. The liner layer within the damascene opening is etched away to expose the region to be contacted wherein this etching comprises a high F/C ratio etch chemistry, low power, and low pressure to complete formation of a damascene opening in the fabrication of an integrated circuit device.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100613376-B1
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