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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
filingDate 2000-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2004-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3aad83d4275a480483917faa5e52c347
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publicationDate 2004-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6720225-B1
titleOfInvention Reactive pre-clean using reducing gas during nickel silicide process
abstract A method of manufacturing a MOSFET semiconductor device comprises providing a gate electrode having first and second opposing sidewalls over a substrate having source/drain regions; providing a gate oxide between the gate electrode and the substrate; forming first and second sidewall spacers respectively disposed adjacent the first and second sidewalls; pre-cleaning the sidewall spacers; forming a nickel layer; and forming nickel silicide layers disposed on the source/drain regions and the gate electrode. The nickel silicide layers are formed during a rapid thermal anneal at temperatures from about 380 to 600° C. The pre-clean uses a hydrogen reactive system in an atmosphere comprising hydrogen and helium. Also, the pre-clean and the formation of the nickel layer are sequentially performed in a single physical vapor deposition chamber system.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013146965-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008242059-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010151677-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8536060-B2
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Total number of triples: 37.