| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1c0fefd3dcd87724f8ae99d386648d82 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L53-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0815 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L53-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-04 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L53-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C41-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-12 |
| filingDate |
2000-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_670f9468d4e42c897c8d28c28dd2b7e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b01a7f2610085ecdcc27b9894de0c1c |
| publicationDate |
2004-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6716923-B1 |
| titleOfInvention |
Resin composition for powder molding |
| abstract |
The invention provides an olefin resin composition for powder molding comprising 100 parts by weight of an olefin resin (A) having a glass transition temperature of 25° C. or lower such as a propylene homopolymer or hydrogenated styrene-butadiene block copolymer and 0.5 to 30 parts by weight of a non-halogen type thermoplastic resin (B) such as methyl methacrylate having a glass transition temperature of 60 to 200° C., an average particle diameter of 0.1 to 10 mum and a sphericity of 0.8 to 1.0.The resin composition is very excellent in powder flowability and can be easily molten even under conditions where there is little or no pressure or shear stress action, and so best suited for use as powder slush molding compositions. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011028625-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011129682-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020301046-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007228595-A1 |
| priorityDate |
1999-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |