| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
2002-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17caee6a09233bedbabc19de785c5a10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d5c4ac97305bbcc1f3a4cd094d805e5 |
| publicationDate |
2004-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6706166-B2 |
| titleOfInvention |
Method for improving an electrodeposition process through use of a multi-electrode assembly |
| abstract |
A method for improving an electrodeposited metal film uniformity and preventing metal deposition and peeling of deposited metal from an electrode during an electrodeposition and electropolishing process including providing a first anode electrode assembly and a semiconductor wafer plating surface disposed in an electrolyte bath including a plating metal for deposition onto the semiconductor wafer plating surface; providing at least one additional anode electrode assembly including the plating metal disposed peripheral to the first anode electrode assembly for selectively applying the cathodic electrical potential during an electropolishing process; and, periodically alternating between an electrodeposition process and electropolishing process with respect to the semiconductor wafer plating surface such that the plating metal is preferentially plated onto the at least one additional electrode assembly. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008132082-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008128268-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11646259-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7799182-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008128013-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7736928-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011031113-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010126849-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7704352-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004009659-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002046043-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008128019-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7098133-B2 |
| priorityDate |
2002-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |