| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76229
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762 |
| filingDate |
2001-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1932ee3508e5cc5e66a8634b04ede698
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b56eea2fdaf0fa9095c9e91b95d7efb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_259dd58266d7a94a55907e2d7970acc3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c2709ae605b08d514c83dfc53fdc5ad |
| publicationDate |
2004-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6677239-B2 |
| titleOfInvention |
Methods and compositions for chemical mechanical polishing |
| abstract |
Methods and apparatus are provided for planarizing substrate surfaces with selective removal rates and low dishing. One aspect of the method provides for processing a substrate including providing a substrate to a polishing platen having polishing media disposed thereon, providing an abrasive free polishing composition comprising one or more surfactants to the substrate surface to modify the removal rates of the at least the first dielectric material and the second dielectric material, polishing the substrate surface, and removing the second material at a higher removal rate than the first material from a substrate surface. One aspect of the apparatus provides a system for processing substrates including a platen adapted for polishing the substrate with polishing media and a computer based controller configured to perform one aspect of the method. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005026439-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8210900-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8586481-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7011574-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7922926-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008153253-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004266085-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010096360-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003148614-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007077865-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005153643-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6841480-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9039914-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010112903-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7951715-B2 |
| priorityDate |
2001-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |