| abstract |
A thermosetting resin composition comprising (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II):wherein R<1 >represents hydrogen, a halogen, or a C1-C5 hydrocarbon group; R<2 >represents a halogen or a C1-C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number,and (2) a cyanate resin having at least two cyanate groups per molecule. To provide a printed wiring board material and a printed wiring board for electronic appliance, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance. |