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publicationDate 2003-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6662992-B2
titleOfInvention Method and apparatus for reducing adhesive build-up on ultrasonic bonding surfaces
abstract A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.
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