| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-523
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1314
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24926
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4629
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49117 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49883 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R12-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2001-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d8fb4bafa49bb56f0874f53f6e8e613
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1efe502e5e8fe86630c192d8cf4bd785
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e9c782524879d30e564b84ace06cd1f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_096ce51254b37c21cb3a1c33dfa4b6df
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60b508a0ce984ba3c04863143e39abd4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88277d7c841955bd0ae0850ad38e889f |
| publicationDate |
2003-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6658733-B2 |
| titleOfInvention |
Method of manufacturing via interconnection of glass-ceramic wiring board |
| abstract |
A via interconnection of a glass-ceramic wiring board is made by blending a copper powder to a vehicle including a cellulose derivative, adding a metal oxide powder having a mean particle diameter of from at least 1 mum to at most 4 mum to the vehicle and blending them, adjusting the viscosity of the vehicle by adding the cellulose derivative and filling them to a via; and sintering the via at a temperature of at least 900° C. to at most 1060° C., and forming the via interconnection. |
| priorityDate |
1999-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |